Organic light emitting diode device and method for fabricating the same

ABSTRACT

Disclosed are an organic light emitting diode device, and a method for fabricating the same. The organic light emitting diode device comprises a non-active area formed outside an active area of a substrate; a switching thin film transistor and a driving thin film transistor at each of the pixel regions; a planarization layer on the substrate; a first electrode on the planarization layer; a bank formed in the non-active area outside each pixel region; an organic light emitting layer on the first electrode; a second electrode on an entire surface of the substrate; a first passivation layer on the substrate; an organic layer on the first passivation layer; a second passivation layer on the organic layer and the first passivation layer; a barrier film disposed to face the substrate.

CROSS-REFERENCE TO RELATED APPLICATION

Pursuant to 35 U.S.C. §119(a), this application claims the benefit ofearlier filing date and right of priority to Korean Application No.10-2012-0142202, filed on Dec. 7, 2012, the contents of which isincorporated by reference herein in its entirety.

BACKGROUND OF THE DISCLOSURE

1. Field of the Disclosure

The present disclosure relates to an organic light emitting diode device(hereinafter, will be referred to as “OLED” device), and particularly,to an OLED device capable of having an enhanced environment reliabilityby preventing moisture from being introduced thereinto from outside, anda method for fabricating the same.

2. Background of the Disclosure

An organic light-emitting diode (OLED) device, one of flat panel displaydevices, has high brightness and a low operation voltage. Further, theOLED device has a high contrast ratio because it is a spontaneouslight-emitting type, and it can implement a display of an ultra thinthickness. The OLED device can easily implement moving images due to ashort response time corresponding to several micro seconds (μs).Besides, the OLED device has no limitation in a viewing angle, and has astable characteristic even at a low temperature. Further, as the OLEDdevice is driven at a low voltage such as a direct current of 5˜15 v, itis easy to fabricate and design driving circuits.

The OLED device can be fabricated in a very simple manner, because onlydeposition and encapsulation equipment is required.

The OLED device having such characteristics is largely categorized intoa passive matrix type and an active matrix type. In the passive matrixtype, scan lines and signal lines cross each other to form an OLEDdevice in a matrix form. In order to drive each pixel, the scan linesare sequentially driven. Accordingly, for a required average brightness,an instantaneous brightness, a value obtained by multiplying an averagebrightness by the number of lines, should be implemented.

On the other hand, in the active matrix type, a thin film transistor(TFT), a switching device for turning on/off a pixel region, is locatedat each pixel region. A driving thin film transistor connected to theswitching thin film transistor is connected to a power line and alight-emitting diode, and is formed at each pixel region.

A first electrode connected to the driving thin film transistor isturned on/off in unit of a pixel region, and a second electrode facingthe first electrode serves as a common electrode. The first electrode,the second electrode, and an organic light-emitting layer interposedbetween the two electrodes constitute the light-emitting diode.

In such active matrix type, a voltage applied to a pixel region ischarged in a storage capacitor (Cst). Power should be applied to theOLED device until a subsequent frame signal is applied to the OLEDdevice. Under such configuration, the OLED device is continuously drivenfor a single frame, regardless of the number of scan lines.

Even if a low current is applied to the OLED device, the same brightnessis implemented. Owing to characteristics of low power consumption, highresolution and a large screen, the active matrix type is beingspotlighted in recent years.

A basic structure and an operation characteristic of such active matrixtype OLED device will be explained with reference to the attacheddrawings.

FIG. 1 is a circuit diagram illustrating a configuration of a singlepixel region of an active matrix type OLED device in accordance with theconventional art.

Referring to FIG. 1, a single pixel region of an active matrix type OLEDdevice is composed of a switching thin film transistor (STr), a drivingthin film transistor (DTr), a storage capacitor (Cst) and alight-emitting diode (E).

Gate lines (GL) are formed in a first direction, and data lines (DL) areformed in a second direction perpendicular to the first direction,thereby defining pixel regions (P). A power line (PL) for applying apower voltage to the OLED device is spaced from the data line (DL).

A switching thin film transistor (STr) is formed at an intersectionbetween the data line (DL) and the gate line (GL), and a driving thinfilm transistor (DTr) electrically connected to the switching thin filmtransistor (STr) is formed in each pixel region (P).

The DTr is electrically connected to a light-emitting diode (E). Morespecifically, a first electrode, a terminal disposed at one side of thelight-emitting diode (E) is connected to a drain electrode of the DTr. Asecond electrode, a terminal disposed at another side of thelight-emitting diode (E) is connected to a power line (PL). The powerline (PL) transmits a power voltage to the light-emitting diode (E). Astorage capacitor (Cst) is formed between a gate electrode and a sourceelectrode of the DTr.

Once a signal is applied to the OLED device through the gate lines (GL),the STr is turned on. And the DTr is turned on as a signal of the datalines (DL) is transmitted to the gate electrode thereof. Accordingly,light is emitted through the light-emitting diode (E). If the DTr isturned on, a level of a current applied to the light-emitting diode (E)from the power line (PL) is determined. As a result, the light-emittingdiode (E) can implement a gray scale.

The storage capacitor (Cst) serves to maintain a gate voltage of the DTrconstantly when the STr is turned off. Accordingly, even if the STr isturned off, a level of a current applied to the light-emitting diode (E)can be constantly maintained for the next frame.

FIG. 2 is a sectional view schematically illustrating an OLED device inaccordance with the conventional art.

Referring to FIG. 2, in the conventional OLED device 10, an active area(AA, display region) and a non-active area (NA, non-display region)formed outside the active area (AA) are defined on a substrate 11. Aplurality of pixel regions (P) defined by gate lines (not shown) anddata lines (not shown) are formed at the active area (AA). A power line(not shown) is formed in parallel to the data lines (not shown).

A switching thin film transistor (not shown) and a driving thin filmtransistor (DTr) are formed at each pixel region (P).

In the conventional organic light-emitting diode device 10, thesubstrate 11, where the DTr and the light-emitting diode (E) have beenformed, is encapsulated by a barrier film (not shown).

The conventional OLED device 10 will be explained in more detail. Asshown in FIG. 2, an active area (AA) and a non-active area (NA) formedoutside the active area (AA) are defined on a substrate 11. A pluralityof pixel regions (P) defined by gate lines (not shown) and data lines(not shown) are formed at the active area (AA). A power line (not shown)is formed in parallel to the data lines (not shown).

A plurality of driving circuit lines (GIP), ground lines (GND), etc. areformed in the non-active area (NA) of the substrate 11.

Although not shown, the DTr is composed of a semiconductor layer, a gateinsulating layer, a gate electrode formed on the gate insulating layeron the semiconductor layer, a source electrode and a drain electrode.The source electrode and the drain electrode are formed on an interlayerinsulating layer formed on the gate insulating layer including the gateelectrode, and are spaced from each other.

An interlayer insulating layer 13 having a drain contact hole (notshown) through which a drain electrode (not shown) of the DTr is exposedto outside, and an organic planarization layer 15 are formed on the DTrand the switching thin film transistor (not shown).

A first electrode 19, contacting the drain electrode (not shown) of theDTr through the drain contact hole (not shown) and provided for eachpixel region (P) in a separated manner, is formed on the organicplanarization layer 15.

A bank 212, by which the pixel regions (P) are separated from eachother, is formed on the first electrode 19. The bank 21 is disposedbetween the pixel regions (P) adjacent to each other. The bank 21 isalso formed in the non-active area (NA), i.e., at an outer portion of apanel.

An organic light-emitting layer 23, composed of organic light-emittingpatterns (not shown) which emit red, green and blue light, is formed onthe first electrode 19 in each pixel (P) enclosed by the bank 21.

A second electrode 25, a cathode is formed on the organic light-emittinglayer 23 and the bank 21, in both of the active area (AA) and thenon-active area (NA). The first electrode 19, the second electrode 25,and the organic light-emitting layer 23 interposed between the twoelectrodes 19, 25 constitute a light-emitting diode (E).

A first passivation layer 27, an insulating layer for preventingintroduction of moisture into the OLED device 10, is formed on theentire surface of the substrate 11 including the second electrode 25.

An organic layer 29, formed of an organic material such as a polymer, isformed on the first passivation layer 27 at the active area (AA).

A second passivation layer 31, configured to prevent introduction ofmoisture into the OLED device 10 through the organic layer 29, isfurther formed over the first passivation layer 27 including the organiclayer 29.

A barrier film (not shown) is positioned on the entire surface of thesubstrate including the second passivation layer 31 in a facing manner,for encapsulation of the light-emitting diode (E) and for prevention ofintroduction of moisture from the upper side. An adhesive (not shown,will be referred to as ‘Press Sensitive Adhesive’, PSA) is interposedbetween the substrate 11 and the barrier film (not shown), so that thesubstrate 11 and the barrier film can be completely attached to eachother without an air layer therebetween. The second passivation layer31, the adhesive (not shown) and the barrier film (not shown) have aface seal structure.

As the substrate 11 and the barrier film (not shown) are attached toeach other by the adhesive (not shown) to thus form a panel, the OLEDdevice 10 according to the conventional art is implemented.

However, the conventional OLED device may have the following problems.

Firstly, when a defect occurs in the face seal structure, e.g., thebarrier film, the adhesive, etc., moisture (H₂O) is rapidly introducedinto an active area (AA) through a planarization layer. In order tosolve such problem, a planarization layer may not be formed at anon-active area (NA). However, in this case, an inorganic insulatinglayer such as the passivation layer disposed on the OLED device has adegraded quality due to a stair-shaped portion.

Secondly, when a defect occurs in the face seal structure, e.g., thebarrier film, the adhesive, etc., moisture (H₂O) is rapidly introducedinto the active area (AA) through a bank. In order to solve suchproblem, a bank may not be formed in the non-active area (NA). However,in this case, moisture may spread through a planarization layer to causea problem.

SUMMARY OF THE DISCLOSURE

Therefore, an aspect of the detailed description is to provide anorganic light-emitting diode (OLED) device capable of having an enhancedenvironment reliability by preventing moisture from being introducedinto an active area from outside, by forming moisture blocking portionsat a planarization layer in a non-active area, and a method forfabricating the same.

To achieve these and other advantages and in accordance with the purposeof this specification, as embodied and broadly described herein, thereis provided an organic light emitting diode device, comprising: asubstrate divided into an active area including a plurality of pixelregions, and a non-active area formed outside the active area; aswitching thin film transistor and a driving thin film transistor formedat each of the pixel regions on the substrate; a planarization layerformed on the substrate including the switching thin film transistor andthe driving thin film transistor, and provided with a moisture blockingportion in the non-active area of the substrate; a first electrodeformed on the planarization layer, and connected to a drain electrode ofthe driving thin film transistor; a bank formed in the non-active areaoutside each pixel region of the substrate including the firstelectrode; an organic light emitting layer formed on the firstelectrode, and provided for each pixel region in a separated manner; asecond electrode formed on an entire surface of the substrate includingthe organic light emitting layer; a first passivation layer formed on anentire surface of the substrate including the second electrode; anorganic layer formed on the first passivation layer; a secondpassivation layer formed on the organic layer and the first passivationlayer; a barrier film disposed to face the substrate; and an adhesiveinterposed between the substrate and the barrier film, and configured toattach the substrate and the barrier film to each other to thusimplement a panel state.

To achieve these and other advantages and in accordance with the purposeof this specification, as embodied and broadly described herein, thereis also provided a method for fabricating an organic light emittingdiode device, the method comprising: providing a substrate divided intoan active area including a plurality of pixel regions, and a non-activearea formed outside the active area; forming a switching thin filmtransistor and a driving thin film transistor at each of the pixelregions on the substrate; forming a planarization layer on the substrateincluding the switching thin film transistor and the driving thin filmtransistor; forming a moisture blocking portion at the planarizationlayer in the non-active area; forming, on the planarization layer, afirst electrode connected to a drain electrode of the driving thin filmtransistor; forming a bank in the non-active area outside each pixelregion of the substrate including the first electrode; forming anorganic light emitting layer on the first electrode in the pixel region;forming a second electrode on an entire surface of the substrateincluding the organic light emitting layer; forming a first passivationlayer on an entire surface of the substrate including the secondelectrode; forming an organic layer on the first passivation layer;forming a second passivation layer on the organic layer and the firstpassivation layer; forming a barrier film so as to face the substrate;and forming an adhesive between the substrate and the barrier film, theadhesive configured to attach the substrate and the barrier film to eachother to thus implement a panel state.

The present invention can have the following advantages.

Firstly, owing to the moisture blocking portions formed at theplanarization layer in the non-active area, foreign materials ormoisture generated from the first passivation layer, the secondpassivation layer, etc. due to occurrence of a crack can be preventedfrom being introduced into the active area.

Foreign materials or moisture inside the planarization layer, which maycause degradation of organic materials inside a light-emitting region,can be outgassed through the anode holes formed at the auxiliaryelectrode pattern disposed in the non-active area. The anode holes,through which the planarization layer and the bank are connected to eachother, may serve as a path through which moisture introduced fromoutside flows to the active area (AA). However, even if moistureintroduced from outside flows through the anode holes, the moisture canbe prevented from moving to the active area (AA) by the moistureblocking portions of the planarization layer formed below the auxiliaryelectrode pattern. This can allow a top emission type OLED deviceadopting a face seal structure, to have an enhanced environmentreliability.

Further scope of applicability of the present application will becomemore apparent from the detailed description given hereinafter. However,it should be understood that the detailed description and specificexamples, while indicating preferred embodiments of the disclosure, aregiven by way of illustration only, since various changes andmodifications within the spirit and scope of the disclosure will becomeapparent to those skilled in the art from the detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the disclosure and are incorporated in and constitute apart of this specification, illustrate exemplary embodiments andtogether with the description serve to explain the principles of thedisclosure.

In the drawings:

FIG. 1 is a circuit diagram illustrating a configuration of a singlepixel region of an active matrix type organic light emitting diode(OLED) device in accordance with the conventional art;

FIG. 2 is a sectional view schematically illustrating an OLED device inaccordance with the conventional art;

FIG. 3 is a planar view schematically illustrating an OLED deviceaccording to the present invention;

FIG. 4 is a sectional view taken along line ‘IV-IV’ in FIG. 3, whichschematically illustrates an OLED device according to the presentinvention;

FIG. 5 is an enlarged sectional view of part ‘A’ in FIG. 4, whichillustrates that introduction of moisture from a moisture blockingportion of a planarization layer and a metallic pattern is prevented;and

FIGS. 6A to 6H are sectional views illustrating processes forfabricating an OLED device according to the present invention.

DETAILED DESCRIPTION OF THE DISCLOSURE

Description will now be given in detail of the exemplary embodiments,with reference to the accompanying drawings. For the sake of briefdescription with reference to the drawings, the same or equivalentcomponents will be provided with the same reference numbers, anddescription thereof will not be repeated.

An organic light emitting diode (OLED) device according to the presentinvention is categorized into a top emission type and a bottom emissiontype according to a propagation direction of emitted light. Hereinafter,a top emission type OLED device will be explained.

FIG. 3 is a planar view schematically illustrating an OLED deviceaccording to the present invention, FIG. 4 is a sectional view takenalong line ‘IV-IV’ in FIG. 3, which schematically illustrates an OLEDdevice according to the present invention, and FIG. 5 is an enlargedsectional view of part ‘A’ in FIG. 4, which illustrates thatintroduction of moisture from a moisture blocking portion of aplanarization layer and a metallic pattern is prevented.

Referring to FIGS. 3 to 5, an OLED device 100 according to the presentinvention has a structure that a substrate 101 where a driving thin filmtransistor (DTr) and a light-emitting diode (E) is encapsulated by abarrier film 137.

Referring to FIGS. 3 and 4, the OLED device 100 comprises a substrate101 divided into an active area (AA, display region) including aplurality of pixel regions (P), and a non-active area (NA, non-displayregion) formed outside the active area (AA); a switching thin filmtransistor (not shown) and a driving thin film transistor (DTr) formedat each pixel region (P) on the substrate 101; a planarization layer 113formed on the substrate 101 including the switching TFT and the DTr, andprovided with moisture blocking portions 115 b in the non-active area(NA) of the substrate; a first electrode 117 formed on the planarizationlayer 113, and connected to a drain electrode 111 of the DTr; a bank 123formed in the non-active area (NA) outside each pixel region (P) of thesubstrate including the first electrode 117; an organic light emittinglayer 123 formed on the first electrode 117, and provided for each pixelregion (P) in a separated manner; a second electrode 127 formed on anentire surface of the substrate including the organic light emittinglayer 123; a first passivation layer 129 formed on an entire surface ofthe substrate including the second electrode 127; an organic layer 131formed on the first passivation layer 129; a second passivation layer133 formed on the organic layer 131 and the first passivation layer 129;a barrier film 137 disposed to face the substrate 101; and an adhesiveinterposed between the substrate 101 and the barrier film 137, andconfigured to attach the substrate 101 and the barrier film 137 to eachother to thus implement a panel state.

The OLED device 100 according to the present invention will be explainedin more detail. As shown in FIGS. 3 to 5, the substrate 101 is dividedinto an active area (AA), and a non-active area (NA) formed outside theactive area (AA). A plurality of pixel regions (P) defined by gate lines(not shown) and data lines (not shown) are provided at the active area(AA). A power line (not shown) is provided in parallel to the data lines(not shown).

As the substrate 101, a glass substrate or a flexible substrate may beused. The flexible substrate may be formed of glass or plastic having aflexible characteristic so that the OLED device 100 can maintain adisplay performance even when folded or rolled-up like paper.

A buffer layer (not shown), formed of an insulating material, e.g., aninorganic insulating material such as silicon dioxide (SiO₂) or siliconnitride (SiNx), is formed on the substrate 101. The reason why thebuffer layer (not shown) is formed below a semiconductor layer 103formed during a subsequent process, is in order to prevent degradationof characteristics of the semiconductor layer 103 due to emission ofalkali ions from inside of the substrate 101 when the semiconductorlayer 103 is crystallized.

The semiconductor layer 103 is formed at each pixel region (P) in theactive area (AA) above the buffer layer (not shown). The semiconductorlayer 103 is formed in correspondence to a driving region (not shown)and a switching region (not shown). And the semiconductor layer 103 iscomposed of a first region 103 a formed of pure poly silicone andforming a channel; and second regions 103 b and 103 c formed of purepoly silicone, disposed at two sides of the first region 103 a, and towhich impurities of high concentration are doped.

A gate insulating layer 105 is formed on the buffer layer including thesemiconductor layer 103. A gate electrode 107 is formed on the gateinsulating layer 105 in correspondence to the first region 103 a of thesemiconductor layer 103 in the driving region (not shown) and theswitching region (not shown).

The gate line (not shown), connected to the gate electrode 107 formed atthe switching region (not shown) and extending to one direction, isformed on the gate insulating layer 105. The gate electrode 107 and thegate line (not shown) may have a single layer structure, by being formedof a first metallic material having a low resistance characteristic,e.g., aluminum (Al), aluminum alloy (AlNd), copper (Cu), copper alloy,molybdenum (Mo), and molybdenum titanium (MoTi). Alternatively, the gateelectrode 107 and the gate line (not shown) may have a double-layered orthree-layered structure by being formed of more than two of the firstmetallic materials. In drawings, the gate electrode 107 and the gateline (not shown) have a single-layered structure. When the gateelectrode 107 is formed, gate driving circuit lines (GIP) 107 a andground lines (GND) 107 b are simultaneously formed in the non-activearea (NA) of the substrate 101.

An interlayer insulating layer 109, formed of an insulating material,e.g., an inorganic insulating material such as silicon dioxide (SiO₂) orsilicon nitride (SiNx), is formed on an entire surface of the substrateincluding the gate electrode 107 and the gate line (not shown), in theactive area. Semiconductor layer contact holes (not shown), throughwhich the second regions 103 b and 103 c disposed at two sides of thefirst region 103 a of the semiconductor layer 103 are exposed tooutside, are provided at the interlayer insulating layer 109 and thegate insulating layer 105 formed therebelow.

Data lines (not shown), which define the pixel regions (P) by crossingthe gate lines (not shown) and formed of a second metallic materiallayer, are formed on the interlayer insulting layer 109 including thesemiconductor layer contact holes (not shown). The second metallicmaterial layer may be formed of one of aluminum (Al), aluminum alloy(AlNd), copper (Cu), copper alloy, molybdenum (Mo), molybdenum titanium(MoTi), chrome (Cr) and titanium (Ti), or a combination of at least twoof them. A power line (not shown) is formed in a spaced manner from thedata lines. The power line (not shown) may be formed on the gateinsulating layer 105 where the gate lines (not shown) have been formed,in a spaced manner from the gate lines (not shown), in parallel thereto.

As shown in FIGS. 4 and 5, a source electrode 111 a and a drainelectrode 111 b, made of the same second metallic material as the datalines (not shown), are formed at a driving region (not shown) and aswitching region (not shown) on the interlayer insulating layer 109. Thesource electrode 111 a and the drain electrode 111 b are spaced fromeach other, and contact the second regions 103 b and 103 c exposed tooutside through the semiconductor layer contact holes (not shown). Undersuch configuration, the semiconductor layer 103, the gate insulatinglayer 105, the gate electrode 107 and the interlayer insulating layer109 sequentially deposited on the driving region (not shown), form adriving thin film transistor (not shown, refer to the DTr of FIG. 6B),together with the source electrode 111 a and the drain electrode 111 bwhich are spaced from each other.

In drawings, all of the data lines (not shown), the source electrode 111a and the drain electrode 111 b have a single-layered structure.However, the data lines (not shown), the source electrode 111 a and thedrain electrode 111 b may have a double-layered structure or athree-layered structure.

Although not shown, a switching thin film transistor (not shown), whichhas the same lamination structure as the driving thin film transistor(DTr), is also formed at the switching region (not shown). The switchingthin film transistor (not shown) is electrically connected to thedriving thin film transistor (DTr), the gate line (not shown) and thedata line (not shown). That is, the gate line (not shown) and the dataline (not shown) are connected to a gate electrode (not shown) and asource electrode (not shown) of the switching thin film transistor,respectively. And a drain electrode (not shown) of the switching thinfilm transistor (not shown) is electrically connected to the gateelectrode 107 of the driving thin film transistor (DTr).

The driving thin film transistor (DTr) and the switching thin filmtransistor (not shown) have the semiconductor layer 103 formed of polysilicon, and are configured as a top gate type. However, the drivingthin film transistor (DTr) and the switching thin film transistor (notshown) may be configured as a bottom gate type which has a semiconductorlayer formed of amorphous silicon.

In a case where the driving thin film transistor (DTr) and the switchingthin film transistor (not shown) are configured as a bottom gate type,they may have a lamination structure of a gate electrode/ a gateinsulating layer/ a semiconductor layer composed of one active layerformed of pure amorphous silicon, and two ohmic layers formed ofimpurity amorphous silicon and disposed at two sides of the activelayer/ and a source electrode and a drain electrode spaced from eachother. The gate line is formed so as to be connected to the gateelectrode of the switching thin film transistor. And the date line isformed so as to be connected to the source electrode.

A planarization layer 113, having a drain contact hole (not shown)through which the drain electrode 111 b of the driving thin filmtransistor (DTr) is exposed to outside, is formed on the driving thinfilm transistor (DTr) and the switching thin film transistor (notshown). The planarization layer 113 may be formed of an insulatingmaterial. For instance, the planarization layer 113 may be formed of oneof an inorganic insulating material including silicon dioxide (SiO₂) andsilicon nitride (SiNx), and an organic insulating material includingphoto-acryl. In the present invention, the planarization layer 113 isformed of an organic insulating material.

A drain contact hole 115 a, through which the first electrode 117 formedduring a subsequent process is electrically connected to the drainelectrode 111 b, is formed at the planarization layer 113 in the activearea of the substrate 101.

A plurality of moisture blocking portions 115 b, configured to preventmoisture from being introduced into the active area from outside, areformed at the planarization layer 113 in the non-active area of thesubstrate 101. Each of the moisture blocking portions 115 b is formed asthe planarization layer 113 disposed in the non-active area (NA) of thesubstrate 101 is cut-out with a prescribed width, which is formed alongan edge region of the non-active area (NA) of the substrate 101. Themoisture blocking portions 115 b are formed at the planarization layer113 positioned above a driving circuit line to which a direct current(DC) is applied, among the ground lines 107 b.

Under such configuration, even if moisture is introduced into the OLEDdevice from outside, the moisture is not introduced to the active area(AA) due to the moisture blocking portions 115 b of the planarizationlayer 113 in the non-active area (NA). That is, the moisture blockingportions 115 b are formed by cutting the planarization layer 113 whichserves as a path along which moisture is introduced. Under suchconfiguration, even if moisture is introduced through the planarizationlayer 113, the moisture moves up to the moisture blocking portions 115 bwithout moving to the planarization layer in the active area (AA).

The first electrode 117, which contacts the drain electrode 111 b of thedriving thin film transistor (DTr) through the drain contact hole (notshown), is formed on the planarization layer 113 in a separated mannerfor each pixel region (P). An auxiliary electrode pattern 119,configured to lower a resistance of the second electrode 127, a cathodeformed during a subsequent process, is simultaneously formed on theplanarization layer 113 in the non-active area (NA). As the secondelectrode 127 formed of a transparent conductive material has a largeresistance, a problem may occur when a constant current is applied tothe second electrode 127. In order to solve such problem, the auxiliaryelectrode pattern 119 is electrically connected to the second electrode127 to thus lower a resistance of the second electrode 127. Theauxiliary electrode pattern 119 is electrically connected to the secondelectrode 127 and the ground line 107 b. The auxiliary electrode pattern119 is electrically connected to the ground line 107 b via a ground linecontact hole (not shown, refer to 115 c of FIG. 5).

In order to outgas foreign materials or moisture generated in theplanarization layer 113 and which may cause degradation of organicmaterials inside a light emitting region, anode holes 121 are formed atthe auxiliary electrode pattern 119 disposed in the non-active area(NA). As the planarization layer 113 and a bank 123 are connected toeach other through the anode holes 121, moisture (H₂O) introduced intothe OLED device from outside may flow toward the active area (AA)through the anode holes 121. However, in this case, the moisture isprevented from being introduced to the active area (AA), by the moistureblocking portions 115 b of the planarization layer 113 formed below theauxiliary electrode pattern 119.

The bank 123, made of an insulating material, such as benzocyclobutene(BCB), polyimide or photo acryl, is formed on the first electrode 117,in the non-active area (NA) outside each pixel region (P). The bank 123is formed to overlap the edge of the first electrode 117 with enclosingeach pixel (P), and has a lattice shape having a plurality of openingsin the entire active area (NA). The bank 123 is also formed in thenon-active area (NA), i.e., at an outer portion of a panel.

An organic light-emitting layer 125, composed of organic light-emittingpatterns (not shown) which emit red, green and blue light, is formed onthe first electrode 117 in each pixel (P) enclosed by the bank 123. Theorganic light-emitting layer 125 may be configured as a single layerformed of an organic light-emitting material. Although not shown, forenhanced light-emitting efficiency, the organic light-emitting layer 125may be configured as a multi-layer formed of a hole injection layer, ahole transporting layer, an emitting material layer, an electrontransporting layer and an electron injection layer.

The second electrode 127 is formed on the active area (AA) of thesubstrate including the organic light-emitting layer 125 and the bank123. The first electrode 117, the second electrode 127, and the organiclight-emitting layer 125 interposed between the two electrodes 121 a,127 form a light-emitting diode (E). The second electrode 127 iselectrically connected to the auxiliary electrode pattern 119.

In the light-emitting diode (E), once a prescribed voltage is applied tothe first electrode 117 and the second electrode 127 according to aselected color signal, a hole injected from the first electrode 117 andan electron provided from the second electrode 127 are transferred tothe organic light-emitting layer 125 to thus form exciton. When theexciton is transited from an excited state to a ground state, light isgenerated to be emitted in the form of visible rays. As the generatedlight is emitted to outside through the transparent second electrode127, the OLED device 100 implements desired images.

The first passivation layer 129, made of an insulating material,especially, an inorganic insulating material such as silicon dioxide(SiO₂) or silicon nitride (SiNx), is formed on the entire surface of thesubstrate 101 including the second electrode 127. The second electrode127 alone cannot prevent introduction of moisture into the organiclight-emitting layer 125. Accordingly, the first passivation layer 129is formed on the second electrode 127 to completely prevent introductionof moisture into the organic light-emitting layer 125.

The organic layer 131, made of an organic material such as polymer, isformed on the first passivation layer 129. As the polymer of the organiclayer 131, may be used olefine-based polymer (polyethylene,polypropylene), polyethylene terephthalate (PET), epoxy resin, fluororesin, polysiloxane, etc.

For prevention of introduction of moisture into the OLED device throughthe organic layer 131, a second passivation layer 133, made of aninsulating material, e.g., an inorganic insulating material such assilicon dioxide (SiO₂) or silicon nitride (SiNx), is further formed onthe entire surface of the substrate 101 including the organic layer 131and the first passivation layer 129.

A barrier film 137 is positioned on the entire surface of the substrate101 including the second passivation layer 133 in a facing manner, forencapsulation of the light-emitting diode (E). An adhesive 135 isinterposed between the substrate 101 and the barrier film 137, so thatthe substrate 101 and the barrier film 137 can be completely attached toeach other without an air layer therebetween. The adhesive 135 is formedof one of transparent frit having an adhesion property, an organicinsulating material and a polymer material. In the present invention,the adhesive 135 is configured as a press sensitive adhesive (PSA).

As the substrate 101 and the barrier film 137 are attached to each otherby the adhesive 135 to thus form a panel, the OLED device 100 accordingto the present invention is implemented.

In the OLED device according to the present invention, the moistureblocking portions are formed at the planarization layer in thenon-active area. Foreign materials or moisture inside the planarizationlayer, which may cause degradation of organic materials inside alight-emitting region, can be outgassed through the anode holes formedat the auxiliary electrode pattern disposed in the non-active area (NA).The anode holes, through which the planarization layer and the bank areconnected to each other, may serve as a path through which moistureintroduced from outside flows to the active area (AA). However, even ifmoisture introduced from outside flows through the anode holes, themoisture can be prevented from moving to the active area (AA) by themoisture blocking portions of the planarization layer formed below theauxiliary electrode pattern. This can allow a top emission type OLEDdevice adopting a face seal structure, to have an enhanced environmentreliability.

In the OLED device according to the present invention, moisture isprevented from being introduced to the active area (AA) by the moistureblocking portions of the planarization layer formed below the auxiliaryelectrode pattern. This can allow a top emission type OLED deviceadopting a face seal structure, to have an enhanced environmentreliability.

Hereinafter, processes for fabricating an OLED device according to thepresent invention will be explained with reference to FIGS. 6A to 6H.

FIGS. 6A to 6H are sectional views illustrating processes forfabricating an OLED device according to the present invention.

As shown in FIG. 6A, prepared is a substrate 101 divided into an activearea (AA), and a non-active area (NA) formed outside the active area(AA). As the substrate 101, a glass substrate or a flexible substratemay be used. The flexible substrate may be formed of glass or plastichaving a flexible characteristic so that an OLED device can maintain adisplay performance even when folded or rolled-up like paper.

A buffer layer (not shown), formed of an insulating material, e.g., aninorganic insulating material such as silicon dioxide (SiO₂) or siliconnitride (SiNx), is formed on the substrate 101. The reason why thebuffer layer (not shown) is formed below a semiconductor layer 103formed during a subsequent process, is in order to prevent degradationof characteristics of the semiconductor layer 103 due to emission ofalkali ions from inside of the substrate 101 when the semiconductorlayer 103 is crystallized.

The semiconductor layer 103 is formed above the buffer layer (not shown)at each pixel region (P) in the active area (AA). The semiconductorlayer 103 is formed in correspondence to the driving region (not shown)and the switching region (not shown). And the semiconductor layer 103 iscomposed of a first region 103 a formed of pure poly silicone andforming a channel; and second regions 103 b and 103 c formed of purepoly silicone, disposed at two sides of the first region 103 a, and towhich impurities of high concentration are doped.

A gate insulating layer 105 is formed on the buffer layer including thesemiconductor layer 103. A gate electrode 107 is formed on the gateinsulating layer 105 in correspondence to the first region 103 a of thesemiconductor layer 103 in the driving region (not shown) and theswitching region (not shown).

A gate line (not shown), connected to the gate electrode 107 formed atthe switching region (not shown) and extending to one direction, isformed on the gate insulating layer 105. The gate electrode 107 and thegate line (not shown) may have a single layer structure, by being formedof a first metallic material having a low resistance characteristic,e.g., aluminum (Al), aluminum alloy (AlNd), copper (Cu), copper alloy,molybdenum (Mo), and molybdenum titanium (MoTi). Alternatively, the gateelectrode 107 and the gate line (not shown) may have a double-layered orthree-layered structure by being formed of more than two of the firstmetallic materials. In drawings, the gate electrode 107 and the gateline (not shown) have a single-layered structure. When the gateelectrode 107 is formed, gate driving circuit lines (GIP) 107 a andground lines (GND) 107 b are simultaneously formed in the non-activearea (NA) of the substrate 101.

As shown in FIG. 6B, an interlayer insulating layer 109, formed of aninsulating material, e.g., an inorganic insulating material such assilicon dioxide (SiO₂) or silicon nitride (SiNx), is formed on an entiresurface of the substrate including the gate electrode 107 and the gateline (not shown).

Then, the interlayer insulating layer 109 and the gate insulating layer105 formed below the interlayer insulating layer 109 are selectivelypatterned, thereby forming semiconductor layer contact holes (notshown), through which the second regions 103 b and 103 c disposed at twosides of the first region 103 a of the semiconductor layer 103 areexposed to outside.

Although not shown, a metallic material layer, which defines the pixelregion (P) by crossing the gate line (not shown), is formed on theinterlayer insulting layer 109 including the semiconductor layer contactholes (not shown). The metallic material layer may be formed of one ofaluminum (Al), aluminum alloy (AlNd), copper (Cu), copper alloy,molybdenum (Mo), molybdenum titanium (MoTi), chrome (Cr) and titanium(Ti), or a combination of at least two of them.

Then, the metallic material layer (not shown) is selectively patterned,thereby forming a data line (not shown) which defines the pixel region(P) by crossing the gate line (not shown), a data driving circuit line(not shown), and a power line (not shown) spaced from the data line. Thepower line (not shown) may be formed on the gate insulating layer 105where the gate lines (not shown) have been formed, in a spaced mannerfrom the gate lines (not shown), in parallel thereto.

When the data lines (not shown) are formed, a source electrode 111 a anda drain electrode 111 b are simultaneously formed. The source electrode111 a and the drain electrode 111 b, made of the same metallic materialas the data lines (not shown), are formed at a driving region (notshown) and a switching region (not shown) on the interlayer insulatinglayer 109. The source electrode 111 a and the drain electrode 111 b arespaced from each other, and contact the second regions 103 b and 103 cexposed to outside through the semiconductor layer contact holes (notshown). Under such configuration, the semiconductor layer 103, the gateinsulating layer 105, the gate electrode 107 and the interlayerinsulating layer 109 sequentially deposited on the driving region (notshown), form a driving thin film transistor (DTr), together with thesource electrode 111 a and the drain electrode 111 b which are spacedfrom each other.

In drawings, all of the data lines (not shown), the source electrode 111a and the drain electrode 111 b have a single-layered structure.However, the data lines (not shown), the source electrode 111 a and thedrain electrode 111 b may have a double-layered structure or athree-layered structure.

Although not shown, a switching thin film transistor (not shown), whichhas the same lamination structure as the driving thin film transistor(DTr), is also formed at the switching region (not shown). The switchingthin film transistor (not shown) is electrically connected to thedriving thin film transistor (DTr), the gate line (not shown) and thedata line (not shown). That is, the gate line (not shown) and the dataline (not shown) are connected to a gate electrode (not shown) and asource electrode (not shown) of the switching thin film transistor,respectively. And a drain electrode (not shown) of the switching thinfilm transistor (not shown) is electrically connected to the gateelectrode 107 of the driving thin film transistor (DTr).

The driving thin film transistor (DTr) and the switching thin filmtransistor (not shown) have the semiconductor layer 103 formed of polysilicon, and are configured as a top gate type. However, the drivingthin film transistor (DTr) and the switching thin film transistor (notshown) may be configured as a bottom gate type which has a semiconductorlayer formed of amorphous silicon.

In a case where the driving thin film transistor (DTr) and the switchingthin film transistor (not shown) are configured as a bottom gate type,they may have a lamination structure of a gate electrode/ a gateinsulating layer/ a semiconductor layer composed of one active layerformed of pure amorphous silicon, and two ohmic layers formed ofimpurity amorphous silicon and disposed at two sides of the activelayer/ and a source electrode and a drain electrode spaced from eachother. The gate line is formed so as to be connected to the gateelectrode of the switching thin film transistor. And the date line isformed so as to be connected to the source electrode.

A planarization layer 113, having a drain contact hole (not shown)through which the drain electrode 111 b of the driving thin filmtransistor (DTr) is exposed to outside, is formed on the driving thinfilm transistor (DTr) and the switching thin film transistor (notshown). The planarization layer 113 may be formed of an insulatingmaterial. For instance, the planarization layer 113 may be formed of oneof an inorganic insulating material including silicon dioxide (SiO₂) andsilicon nitride (SiNx), and an organic insulating material includingphoto-acryl. In the present invention, the planarization layer 113 isformed of an organic insulating material.

As shown in FIG. 6C, the planarization layer 113 is selectivelypatterned through an exposing process and a developing process, therebyforming a drain contact hole 115 a at the planarization layer 113 in theactive area of the substrate 101, the drain contact hole 115 a throughwhich the first electrode 117 formed during a subsequent process iselectrically connected to the drain electrode 111 b.

A plurality of moisture blocking portions 115 b, configured to preventmoisture from being introduced into the active area (AA) from outside,are formed at the planarization layer 113 in the non-active area of thesubstrate 101. Each of the moisture blocking portions 115 b is formed asthe planarization layer 113 positioned in the non-active area (NA) ofthe substrate 101 is cut-out with a prescribed width, which is formedalong an edge region of the non-active area (NA) of the substrate 101.The moisture blocking portions 115 b are formed at the planarizationlayer 113 positioned above a driving circuit line to which a directcurrent (DC) is applied, among the ground lines 107 b.

Under such configuration, even if moisture is introduced into the OLEDdevice from outside, the moisture is not introduced to the active area(AA) due to the moisture blocking portions 115 b of the planarizationlayer 113 in the non-active area (NA).

When the drain contact hole 115 a and the moisture blocking portions 115b are formed, a ground line contact hole 115 c through which the groundline 107 b is exposed to outside, is simultaneously formed.

As shown in FIG. 6D, a metallic material layer (not shown) is depositedon the entire surface of the substrate including the planarization layer113, and then is selectively patterned, thereby forming a firstelectrode 117 on the planarization layer 113. The first electrode 117contacts the drain electrode 111 b of the driving thin film transistor(DTr) through the drain contact hole 115 a, and is formed in a separatedmanner for each pixel region (P). An auxiliary electrode pattern 119,configured to lower a resistance of the second electrode 127, a cathodeformed during a subsequent process, is simultaneously formed on theplanarization layer 113 in the non-active area (NA). As the secondelectrode 127 formed of a transparent conductive material has a largeresistance, a problem may occur when a constant current is applied tothe second electrode 127. In order to solve such problem, the auxiliaryelectrode pattern 119 is electrically connected to the second electrode127 to thus lower a resistance of the second electrode 127. Theauxiliary electrode pattern 119 is electrically connected to the secondelectrode 127 and the ground line 107 b. The auxiliary electrode pattern119 is electrically connected to the ground line 107 b via the groundline contact hole 115 c. The metallic material layer (not shown) may beformed of one of aluminum (Al), aluminum alloy (AlNd), copper (Cu),copper alloy, molybdenum (Mo), molybdenum titanium (MoTi), chrome (Cr)and titanium (Ti), or a combination of at least two of them.

In order to outgas foreign materials or moisture generated in theplanarization layer 113 and which may cause degradation of organicmaterials inside a light emitting region, anode holes 121 are formed atthe auxiliary electrode pattern 119 disposed in the non-active area(NA). The anode holes 121 are simultaneously formed with the firstelectrode 117 and the auxiliary electrode pattern 119. As theplanarization layer 113 and a bank 123 are connected to each otherthrough the anode holes 121, moisture (H₂O) introduced into the OLEDdevice from outside may be introduced toward the active area (AA)through the anode holes 121. However, in this case, the moisture isprevented from being introduced to the active area (AA), by the moistureblocking portions 115 b of the planarization layer 113 formed below theauxiliary electrode pattern 119.

As shown in FIG. 6E, a bank 123, made of an insulating material, such asbenzocyclobutene (BCB), polyimide or photo acryl, is formed on the firstelectrode 117, in the non-active area (NA) outside each pixel region(P). The bank 123 is formed to overlap the edge of the first electrode117 with enclosing each pixel (P), and has a lattice shape having aplurality of openings in the entire active area (A/A). The bank 123 isalso formed in the non-active area (NA), i.e., at an outer portion of apanel.

An organic light-emitting layer 125, composed of organic light-emittingpatterns (not shown) which emit red, green and blue light, is formed onthe first electrode 117 in each pixel (P) enclosed by the bank 123. Theorganic light-emitting layer 125 may be configured as a single layerformed of an organic light-emitting material. Although not shown, forenhanced light-emitting efficiency, the organic light-emitting layer 125may be configured as a multi-layer formed of a hole injection layer, ahole transporting layer, an emitting material layer, an electrontransporting layer and an electron injection layer.

As shown in FIG. 6F, a transparent conductive material layer (notshown), formed of a transparent conductive material including ITO andIZO, is deposited on the entire surface of the substrate including theorganic light-emitting layer 125 and the bank 123. Then, the transparentconductive material layer is selectively patterned, thereby forming asecond electrode 127 on the active area (AA) of the substrate includingthe organic light-emitting layer 125 and the bank 123. The firstelectrode 117, the second electrode 127, and the organic light-emittinglayer 125 interposed between the two electrodes 121 a, 127 form alight-emitting diode (E). The second electrode 127 is electricallyconnected to the auxiliary electrode pattern 119.

In the light-emitting diode (E), once a prescribed voltage is applied tothe first electrode 117 and the second electrode 127 according to aselected color signal, a hole injected from the first electrode 117 andan electron provided from the second electrode 127 are transferred tothe organic light-emitting layer 125 to thus form exciton. When theexciton is transited from an excited state to a ground state, light isgenerated to be emitted in the form of visible rays. As the generatedlight is emitted to outside through the transparent second electrode127, the OLED device 100 implements desired images.

As shown in FIG. 6G, the first passivation layer 129, made of aninsulating material, especially, an inorganic insulating material suchas silicon dioxide (SiO₂) or silicon nitride (SiNx), is formed on theentire surface of the substrate 101 including the second electrode 127.The second electrode 127 alone cannot prevent introduction of moistureinto the organic light-emitting layer 125. Accordingly, the firstpassivation layer 129 is formed on the second electrode 127 tocompletely prevent introduction of moisture into the organiclight-emitting layer 125.

As shown in FIG. 6H, the organic layer 131, made of an organic materialsuch as polymer, is formed on the first passivation layer 129 in theactive area (AA). As the polymer of the organic layer 131, may be usedolefine-based polymer (polyethylene, polypropylene), polyethyleneterephthalate (PET), epoxy resin, fluoro resin, polysiloxane, etc.

For prevention of introduction of moisture into the OLED device throughthe organic layer 131, a second passivation layer 133, made of aninsulating material, e.g., an inorganic insulating material such assilicon dioxide (SiO₂) or silicon nitride (SiNx), is further formed onthe entire surface of the substrate 101 including the organic layer 131and the first passivation layer 129.

A barrier film 137 is positioned on the entire surface of the substrate101 including the second passivation layer 133 in a facing manner, forencapsulation of the light-emitting diode (E). An adhesive 135 isinterposed between the substrate 101 and the barrier film 137, so thatthe substrate 101 and the barrier film 137 can be completely attached toeach other without an air layer therebetween. The adhesive 135 is formedof one of transparent frit having an adhesion property, an organicinsulating material and a polymer material. In the present invention,the adhesive 135 is configured as a press sensitive adhesive (PSA).

As the substrate 101 and the barrier film 137 are attached to each otherby the adhesive 135 to thus form a panel, the fabrication processes ofthe OLED device 100 according to the present invention are completed.

In the method for fabricating an OLED device according to the presentinvention, the moisture blocking portions are formed at theplanarization layer in the non-active area. Foreign materials ormoisture inside the planarization layer, which may cause degradation oforganic materials inside a light-emitting region, can be outgassedthrough the anode holes formed at the auxiliary electrode patterndisposed in the non-active area (NA). The anode holes, through which theplanarization layer and the bank are connected to each other, may serveas a path through which moisture introduced from outside flows to theactive area (AA). However, even if moisture introduced from outsideflows through the anode holes, the moisture can be prevented from movingto the active area (AA) by the moisture blocking portions of theplanarization layer formed below the auxiliary electrode pattern. Thiscan allow a top emission type OLED device adopting a face sealstructure, to have an enhanced environment reliability.

In the method for fabricating an OLED device according to the presentinvention, moisture is prevented from being introduced to the activearea (AA) by the moisture blocking portions of the planarization layerformed below the auxiliary electrode pattern. This can allow a topemission type OLED device adopting a face seal structure, to have anenhanced environment reliability.

The foregoing embodiments and advantages are merely exemplary and arenot to be considered as limiting the present disclosure. The presentteachings can be readily applied to other types of apparatuses. Thisdescription is intended to be illustrative, and not to limit the scopeof the claims. Many alternatives, modifications, and variations will beapparent to those skilled in the art. The features, structures, methods,and other characteristics of the exemplary embodiments described hereinmay be combined in various ways to obtain additional and/or alternativeexemplary embodiments.

As the present features may be embodied in several forms withoutdeparting from the characteristics thereof, it should also be understoodthat the above-described embodiments are not limited by any of thedetails of the foregoing description, unless otherwise specified, butrather should be considered broadly within its scope as defined in theappended claims, and therefore all changes and modifications that fallwithin the metes and bounds of the claims, or equivalents of such metesand bounds are therefore intended to be embraced by the appended claims.

What is claimed is:
 1. An organic light emitting diode device,comprising: a substrate divided into an active area including aplurality of pixel regions, and a non-active area formed outside theactive area; a switching thin film transistor and a driving thin filmtransistor formed at each of the pixel regions on the substrate; aplanarization layer formed on the substrate including the switching thinfilm transistor and the driving thin film transistor, and provided witha moisture blocking portion in the non-active area of the substrate; afirst electrode formed on the planarization layer, and connected to adrain electrode of the driving thin film transistor; a bank formed inthe non-active area outside each pixel region of the substrate includingthe first electrode; an organic light emitting layer formed on the firstelectrode, and provided for each pixel region in a separated manner; asecond electrode formed on an entire surface of the substrate includingthe organic light emitting layer; a first passivation layer formed on anentire surface of the substrate including the second electrode; anorganic layer formed on the first passivation layer; a secondpassivation layer formed on the organic layer and the first passivationlayer; a barrier film disposed to face the substrate; and an adhesiveinterposed between the substrate and the barrier film, and configured toattach the substrate and the barrier film to each other to thusimplement a panel state.
 2. The organic light emitting diode device ofclaim 1, wherein the moisture blocking portion is formed in at least onein number, along an edge region of the non-active area of the substrate.3. The organic light emitting diode device of claim 1, wherein themoisture blocking portion is formed at the planarization layercorresponding to driving circuit lines, in the non-active area of thesubstrate.
 4. The organic light emitting diode device of claim 3,wherein the moisture blocking portion is formed at the planarizationlayer positioned above a driving circuit line to which a direct currentis applied, among the gate driving circuit lines.
 5. The organic lightemitting diode device of claim 1, wherein an auxiliary electrodepattern, electrically connected to the first electrode, is formed on theplanarization layer positioned in the non-active area of the substrate.6. The organic light emitting diode device of claim 1, wherein thesubstrate is configured as one of a glass substrate, a flexible glasssubstrate and a plastic substrate.
 7. A method for fabricating anorganic light emitting diode device, the method comprising: providing asubstrate divided into an active area including a plurality of pixelregions, and a non-active area formed outside the active area; forming aswitching thin film transistor and a driving thin film transistor ateach of the pixel regions on the substrate; forming a planarizationlayer on the substrate including the switching thin film transistor andthe driving thin film transistor; forming a moisture blocking portion atthe planarization layer in the non-active area; forming, on theplanarization layer, a first electrode connected to a drain electrode ofthe driving thin film transistor; forming a bank in the non-active areaoutside each pixel region of the substrate including the firstelectrode; forming an organic light emitting layer on the firstelectrode in the pixel region; forming a second electrode on an entiresurface of the substrate including the organic light emitting layer;forming a first passivation layer on an entire surface of the substrateincluding the second electrode; forming an organic layer on the firstpassivation layer; forming a second passivation layer on the organiclayer and the first passivation layer; forming a barrier film so as toface the substrate; and forming an adhesive between the substrate andthe barrier film, the adhesive configured to attach the substrate andthe barrier film to each other to thus implement a panel state.
 8. Themethod of claim 7, wherein the moisture blocking portion is formed in atleast one in number, along an edge region of the non-active area of thesubstrate.
 9. The method of claim 7, wherein the moisture blockingportion is formed at the planarization layer corresponding to drivingcircuit lines, in the non-active area of the substrate.
 10. The methodof claim 9, wherein the moisture blocking portion is formed at theplanarization layer positioned above a driving circuit line to which adirect current is applied, among the gate driving circuit lines.
 11. Themethod of claim 7, wherein an auxiliary electrode pattern, electricallyconnected to the first electrode and having a plurality of anode holes,is formed on the planarization layer, in the non-active area of thesubstrate.
 12. The method of claim 11, wherein the auxiliary electrodepattern is simultaneously formed with the first electrode.
 13. Themethod of claim 7, wherein the substrate is configured as one of a glasssubstrate, a flexible glass substrate and a plastic substrate.